TWS Bluetooth main control chip core technology

TWS Bluetooth main control chip core technology

In TWS, the importance of Bluetooth master chip is self-evident. Unlike relatively large mobile phones and other headsets, the portability of TWS requires higher requirements for the size and integration of the main control chip. With the addition of new modules such as noise reduction and functional sensors, higher requirements are put forward for the space utilization of the cavity and the high integration of the chip. A fully functional and highly integrated Bluetooth main control SoC provides a strong guarantee for TWS to achieve a variety of functions.

At present, there are dozens of manufacturers in the TWS main control chip market, and the market is gradually mature, and the competition among manufacturers is fierce. The high-end market is represented by Apple, Qualcomm, Hengxuan, Broadcom, and the low-end market includes Loda, Realtek, and China Blue News. According to incomplete statistics, as of October 2020, there are more than 22 TWS master Bluetooth chip manufacturers in China.

The Qualcomm QCC5124 System-on-Chip (SoC) is designed to meet the needs of small devices for a robust, high-quality, wireless Bluetooth listening experience with low power consumption for longer audio playback. The QCC5124 architecture is designed for high performance with low power consumption. Compared to previous technologies, power consumption can be reduced by up to 65%, which can support longer audio playback in almost all operating modes.